diptrace-bom-sourcing

Read runtime access before selecting tools or declaring a capability unavailable. MCP tools and native/headless CLI are separate interfaces.

DipTrace BOM and sourcing

RAG: engineering memory by default — shared workflow. Bring component/nonideality, sourcing and design-course knowledge into BOM review, substitutions, margins and lifecycle tradeoffs; verify live stock and prices separately.

Prepare an auditable procurement BOM. Catalog searches and local documents are in scope; purchasing or changing the circuit requires authorization for those actions.

Baseline

1. Resolve schematic/PCB revision, assembly variant, fitted/DNP state, board count, assembler, and allowed substitutions from the request and project.
2. Discover live MCP tools, then use get_document_info, run_bom_review, and export_bom. When both CAD documents exist, use compare_schematic_to_pcb. Keep source hashes and original exports.
3. Normalize one row per exact manufacturer/MPN/package/variant combination, preserving RefDes membership. Record value, tolerance/rating, footprint, quantity per board, supplier code, stock/date, unit price/currency/price break, lead time, and evidence. Exclude Net Ports and documentary objects. Preserve DNP and hand-assembly lists.
4. Multiply fitted quantity by board count; account explicitly for approved spares, attrition, MOQ, and order multiples. If the board count is unknown, complete the per-board BOM and leave order totals pending.

Source and compare

• Search exact installed parts with query_builtin_library_catalog first. On a supported Windows host, this can export installed component libraries to an XML cache through hidden Component Editor without modifying the installed library.
• For missing catalog data, pipeline_source_component resolves an MPN/LCSC code and writes combined EasyEDA JSON plus an available PDF into an explicit project vendor directory. It does not import a native library or reserve stock. Verify the exact MPN/package, JSON symbol and footprint records, and actual PDF content; preserve returned paths/hashes. Convert geometry only through a supported import or a validated project converter, checking units, orientation, pad geometry and pin-to-pad aliases. Check official package evidence with diptrace-datasheet-rules.
• Verify stock, category, current orderability, price breaks, and assembly availability on the supplier/assembler's current service. Timestamp results. LCSC warehouse stock does not prove JLCPCB assembly stock; cached stock is not a reservation.
• For JLCPCB, prefer Basic, then Preferred Extended, then Extended among technically valid choices. Minimize unique types only when ratings, behavior, and packaging remain suitable. Use the chosen assembler's rules for other suppliers.
• Evaluate substitutes against function, pinout, package/land pattern, electrical limits, tolerances, temperature, dynamic behavior, and relevant firmware effects. Include capacitor effective capacitance, inductor saturation/current, and ferrite impedance/DC resistance when those characteristics matter to the circuit.
• A shared value or package name is not equivalence. Separate drop-in candidates from changes needing a new footprint, schematic, layout, firmware, or qualification. Propose an ECO through diptrace-revision-review when applicable; sourcing by itself does not apply substitutions.

Deliver

Write BOM_SOURCING.csv and a short BOM_SOURCING.md (or update the project's existing equivalents) with shortages, unresolved identities, proposed substitutions, quantity arithmetic, cost assumptions, and timestamped sources. Use a CSV library, not string concatenation, and preserve identifiers and units.

Reconcile all fitted RefDes with CAD and disclose stock/price uncertainty. Mark order readiness BLOCKED for unresolved required parts or variant ambiguity. Recheck time sensitive facts at order time and pass the resolved BOM to diptrace-production-pack.

Return the shared result; use document: null when no CAD document is involved. Record concrete artifacts and unavailable checks; a completed plan is not physical or manufacturing acceptance.